what has demanded from practical applications for collecting the big data. Therefore, to resolve the cost issues, a R2R printing foundry has been highly attracted because the flexible passive components (such as sensor electrodes, capacitors, and antenna) are able to integrate with their flexible active components (such as display, processor, [3] transponder, [4] analogto-digital converter (ADC), [5] operation amplifier [6]) through a R2R inline printing system. [7] However, although sensor electrodes, [8] capacitors, [9] antenna, [10] and thin film transistor (TFT) active matrix-based display [11] have been successfully printed via R2R printing method, they cannot integrate with flexible active components yet through the R2R inline printing system so far. The major reason in difficulty of inline integration of R2R printed passive components with the flexible active components was mainly originated from the incompatibility between printing and vacuum deposition techniques, employed in manufacturing those flexible active components. Although a printing process was incorporated with the vacuum deposition methods in fabricating those flexible active components, it was limited to fabricating only the semiconducting layers, [12] and lacked the scalability required for practical mass production. Thus, those hybrid vacuum deposition and printing processes cannot be incorporated into the R2R printing foundry. To establish the R2R printing foundry concept, the design rule that encompasses physical dimensions and electrical parameters of the fully printed devices should be first established. The design rule in a semiconductor fabrication plant-referred to as the foundry-is a compromised rule between circuit design engineers and process engineers to provide the geometry of an integrated circuit layout with an acceptable cost. However, unlike the Si-chip foundry, the printed devices' physical dimensions and electrical parameters are variable to the rheological parameters of the electronic inks, the web tension, printing speed, and overlay printing registration accuracy (OPRA) of employed R2R printer. Therefore, the design rule of the R2R printing foundry (Figure 1a) should be always comprising characteristics of both employed ink and R2R printer to prove that the R2R printed complementary metal-oxide-semiconductor (CMOS)-based active