High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

“…Therefore, the inherent low thermal conductivity, high inflammability, and electromagnetic wave (EMW) transmittance of polymer-based electronic packaging materials largely hinder its application in 5G electronic devices. [3][4][5] Moreover, excessively fast heat accumulation may also lead to the temperature over the ignition point of the polymers, thus, causing a fire. [6] As a consequence, there is an urgent need to design multifunctional polymer-based electronic packaging materials with high thermal conductivity, EMW absorption, and flame retardancy.…”

“…Figure 3e shows the comparison of the lowest RL and thickness of the MDCH@LDH-2 prepared in this study and the carbon-based absorbers reported in the literature. [4,[27][28][29][30][31][32][33][34][35][36] Notably, the RL min of MDCH@LDH-2 reaches 57.77 dB at a thickness of 2.5 mm. It is difficult for most of the reported EMA materials to achieve such excellent EMW loss capability at such a low sample thickness.…”

Thermally conductive polymer-based composites: fundamentals, progress and flame retardancy/anti-electromagnetic interference design

“…In another work, by carbonizing melamine foam loaded with h-BN and then compounding with EP, composites with both high thermal conductivity and electromagnetic wave absorbing capacity were made. 223…”

“…In another work, by carbonizing melamine foam loaded with h-BN and then compounding with EP, composites with both high thermal conductivity and electromagnetic wave absorbing capacity were made. 223 A modified ALD method was used to coat the surface of CNTs with a highly uniform NiO film (Fig. 25a).…”

Engineering of the Core–Shell Boron Nitride@Nitrogen-Doped Carbon Heterogeneous Interface for Efficient Heat Dissipation and Electromagnetic Wave Absorption

“…A lot of heat and EW radiation produced by electronic devices cannot be dissipated in time, which thereby causes a decrease in performance or even damage. To ensure their operational reliability and stability, it is highly desirable for absorbers to achieve both efficient multiband EWA and high thermal conductivity properties. , …”