1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
DOI: 10.1109/ectc.1998.678726
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High performance, low-cost chip-on-board (COB) FDDI transmitter and receiver for avionics applications

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Cited by 6 publications
(5 citation statements)
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“…Typical values are 10 −6 to 10 −13 errors/bit, although error rates in the field are said to vary dramatically. Some standards for optical networks specify maximum allowable BERs, such as 2.5 * 10 −10 in the Boeing ARINC 636 standard [11] and 10 −12 for Gigabit Ethernet [40]. Copper BERs are typically higher.…”
Section: Network Mediummentioning
confidence: 99%
“…Typical values are 10 −6 to 10 −13 errors/bit, although error rates in the field are said to vary dramatically. Some standards for optical networks specify maximum allowable BERs, such as 2.5 * 10 −10 in the Boeing ARINC 636 standard [11] and 10 −12 for Gigabit Ethernet [40]. Copper BERs are typically higher.…”
Section: Network Mediummentioning
confidence: 99%
“…The bit error rate class includes faults from jitter and amplitude disturbances on the network. Three optical standards give worst-case BERs ranging from 10 −12 to 10 −10 [9], [23], [35]; we study a less pessimistic range of 10 −13 to 10 −11 . The fourth class, electromagnetic interference, includes correlated burst errors [30], [17], [18].…”
Section: Protocol Overview and Related Workmentioning
confidence: 99%
“…This is comparable to the size of protocol controllers. For example, the TTP-C2NF revision 1.2 chip [26], [11] 10 −10 , 10 −9 , 10 −8 /bit-hr BER [9], [23], [35] 10 −13 , 10 −12 , 10 −11 err/bit Lightning [12] 4*10 −4 /hr has 40 kBytes of SRAM and 32 kBytes of ROM [2]. We perform sensitivity analysis for 256 kBytes.…”
Section: Fault Models and Mappingsmentioning
confidence: 99%
“…At Boeing, a new avionics transmitter and receiver packaging 2.A.6-2 concept based on chip-on-board (COB) technology resulted in a lower-cost design [21]. The chip-onboard package utilized large format multi-chip module laminate (MCM-L) substrates and glob top encapsulation of the integrated circuits.…”
Section: Second Generation Legacy Avionics Packaging Lesson's Learnedmentioning
confidence: 99%