2001
DOI: 10.1109/22.954775
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High-Q LTCC-based passive library for wireless system-on-package (SOP) module development

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Cited by 164 publications
(78 citation statements)
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“…However, when the value of parameter R z is changed to smaller, the width of low impedance line is too large relative to the high impedance line width according to Equation (1), and the miniaturization of the eighth-order SIR filter will be affected. In this work, a folded structure is utilized for smaller-sized design, and much high capacitance value can be realized when the two-layer SIR, depicted in Figure 5, is applied.…”
Section: Design Of Filter Bankmentioning
confidence: 99%
See 1 more Smart Citation
“…However, when the value of parameter R z is changed to smaller, the width of low impedance line is too large relative to the high impedance line width according to Equation (1), and the miniaturization of the eighth-order SIR filter will be affected. In this work, a folded structure is utilized for smaller-sized design, and much high capacitance value can be realized when the two-layer SIR, depicted in Figure 5, is applied.…”
Section: Design Of Filter Bankmentioning
confidence: 99%
“…Filter, as an important passive component, is an indispensable part of the RF circuit [1][2][3]. With the development of communication technology, the requirements of the performance about filters are increasing.…”
Section: Introductionmentioning
confidence: 99%
“…High Q inductors are required for bandpass filters and matching networks. Inductors fabricated in LTCC or M-LCP, can have very high Qs [2,3]. Spiral inductors are very popular because they provide inductances in the order of several nHs [11], in compact sizes.…”
Section: Spiral Inductorsmentioning
confidence: 99%
“…Low Temperature Co-fired Ceramic (LTCC) has been the choice for SoP designs in the recent years. Lumped components implemented in LTCC have demonstrated high quality factors and small form factors [2]. Even though LTCC is a mature technology, it is expensive, non flexible, and inorganic (not environmentally friendly).…”
Section: Introductionmentioning
confidence: 99%
“…There have been significant efforts in 3D microwave circuits including filters, resonators, branch-line couplers, antennas, matching circuits, and power splitters on multi-layer integrated circuits [3][4] and growing research activities on the electromagnetic applications of engineered materials such as metamaterials, where the material characteristics can be tailored [5][6][7].…”
Section: Introductionmentioning
confidence: 99%