High quality factor microwave dielectric diopside glass-ceramics for the low temperature co-fired ceramic (LTCC) applications

Concurrent sinter-crystallization and microwave dielectric characterization of CaO-MgO-TiO2-SiO2 glass-ceramics

“…By increasing sintering temperature, the crystallinities drastically increased and the relative density continuously declined tõ 88%. Therefore, the increase of sintering temperature interrupts densification through enhancement of crystallinity and effective increase of the residual glass phase viscosity [26]. Figure 8 shows the microwave dielectric properties of glasses with different TiO 2 content and glass-ceramics sintered at various temperatures for 4 h [27,28].…”

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

“…With the rapid development of technology, electronic devices are becoming smaller and more multidirectional. Thus, the miniaturization and integration of electronic devices are receiving increasing attention [1][2][3][4][5][6][7][8][9]. Various glasses and glass-ceramics are widely used or considered for use as components of electronic materials due to their promising properties [10][11][12][13][14].…”

“…Various glasses and glass-ceramics are widely used or considered for use as components of electronic materials due to their promising properties [10][11][12][13][14]. Porosity, hardness, strength, translucency, opacity, thermal expansion, temperature stability, chemical durability, thermal conductivity, dielectric loss, and resistivity can be designed and tailored in glass-ceramics [2,3,10,13]. Among glass-ceramic materials, low-temperature co-fired ceramics (LTCC) are multilayered ceramic materials that are important due to their exceptional physical and chemical properties [7,10,15,16].…”

“…The significant characteristics of LTCC are excellent dielectric properties, high thermal conductivity, cost-effectiveness, and sintering temperature below the melting points of metal electrodes (Ag or Cu or Au). Thus, sintering below 950 • C makes it unique for miniaturized and integrated electronic devices [1,3,4,7,8,11,[19][20][21][22]. Besides, glass content embedded in a ceramic system provides multifunctional characteristics, such as high strength and high durability [10,14,23].…”

Investigation of the effects of silica coating on the thermal conductivity and porosity of aluminum nitride after sintering

“…The development of semiconductor chips for high voltage control and high-speed wireless communications is progressing, miniaturization of the package substrates contained in semiconductor chips is also required by industry [1][2][3][4]. These packages are usually manufactured using a low-temperature co-fired ceramic (LTCC) technology [5,6], the sintering temperature of which is approximately 1000°C due to the use of glass for the substrates. Packages derived from this technology can be sintered with low electrical resistance metals such as gold, silver, and copper.…”