High‐Reliability Connection Products for Packaging Technology in Microelectronics

Abstract

The current reliability problems related to bonding wires and solder paste are shown, and possible solutions are discussed. Five morphological categories of failure modes are identified. We set out the basic principles for specifying solder pastes, especially with regard to the powder used. The continuing trend towards miniaturization of SMT assembly production demands a commensurate reduction in powder‐particle size, and the use of a compatible fluxing system. A judicious selection of the powder type can improve printing and soldering quality, and thus expand the process‐operation window. Comparing wire‐bonding technology with solder joints for Flip Chip applications, failure mechanisms, like Kirkendall voids, are present and will be discussed.