2007
DOI: 10.1021/jp0751413
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High-Resolution Synchrotron Photoemission Studies of the Electronic Structure and Thermal Stability of CH3- and C2H5-Functionalized Si(111) Surfaces

Abstract: The relative coverage, thermal stability, and electronic properties of CH 3 -and C 2 H 5 -functionalized Si(111) surfaces prepared by a two-step chlorination/alkylation procedure have been compared using high-resolution synchrotron photoemission spectroscopy. Whereas the CH 3 -terminated Si(111) surface showed only one C 2s peak for the occupied σ orbitals, the C 2s spectra of C 2 H 5 -terminated Si(111) surfaces showed a symmetric splitting of the occupied σ orbitals, as expected for an ethyl moiety bonded to… Show more

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Cited by 42 publications
(99 citation statements)
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“…SiÀC bonds on Si(111) and Si(100) have been shown to produce less than 0.2 eV band bending. [33,43,83] Furthermore, the observed inversion [20] in n-SiÀalkyl/Hg (Fig. 3) and n-SiÀOÀalkyl/Hg junctions [88] (see Section 4.2) implies that the Si surface is not pinned, supporting the idea that CÀSi and CÀOÀSi surface terminations effectively passivate the Si surface both chemically (preventing oxidation) and electronically (small density of surface states).…”
Section: Passivation Of Surface Statesmentioning
confidence: 63%
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“…SiÀC bonds on Si(111) and Si(100) have been shown to produce less than 0.2 eV band bending. [33,43,83] Furthermore, the observed inversion [20] in n-SiÀalkyl/Hg (Fig. 3) and n-SiÀOÀalkyl/Hg junctions [88] (see Section 4.2) implies that the Si surface is not pinned, supporting the idea that CÀSi and CÀOÀSi surface terminations effectively passivate the Si surface both chemically (preventing oxidation) and electronically (small density of surface states).…”
Section: Passivation Of Surface Statesmentioning
confidence: 63%
“…[32] The downside of the stable binding to Si, 4 eV bond energy for SiÀC and 4.7 eV for SiÀO(ÀC), is that the resulting monolayer is less ordered, because diffusion of the adsorbed molecules on the surface to improve ordering is more difficult. The upside is that it is more robust against substrate oxidation, can withstand heating [33] and that metal atom diffusion during top contact deposition is less likely. [34] Amongst other binding chemistries, only CÀC bonding to graphite (or burned photo-resist, see Ref.…”
Section: Why Silicon? Semiconducting Versus Metallic Electrodesmentioning
confidence: 99%
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