High-speed Electro-absorption Modulator Assisted by Iron Doping for Micro-Transfer-Printing Integration

Shi, Shengtai; Mulcahy, Jack; Dai, Xing; Peters, Frank H.

doi:10.1109/siphotonics60897.2024.10544327

2024 IEEE Silicon Photonics Conference (SiPhotonics) 2024

DOI: 10.1109/siphotonics60897.2024.10544327

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High-speed Electro-absorption Modulator Assisted by Iron Doping for Micro-Transfer-Printing Integration

Shengtai Shi,

Jack Mulcahy,

Xing Dai

et al.

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High-speed Electro-absorption Modulator Assisted by Iron Doping for Micro-Transfer-Printing Integration

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References 3 publications

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