High stability and aging resistance Sn-1Ag-0.5Cu solder alloy by Fe and Bi minor alloying

Mahdavifard, Mohammad Hossein; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Rozali, Shaifulazuar

doi:10.1016/j.mee.2019.01.011

Cited by 25 publications

(5 citation statements)

References 27 publications

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“…The corresponding outcomes were documented by M.H. Mahdavifard et al [10], as well as H. Fallahi et al reported the effect of indium upon the mechanical characteristics of the non-toxic solder alloy [11]. The study conclusion corelates and best matches with the previous findings and also makes a comparison of the indium-doped and without indium alloy.…”

Section: Resultssupporting

confidence: 83%

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Hameed,

Wakeel,

Pasha

et al. 2023

Icame 2023

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Section: Resultssupporting

confidence: 83%

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Hameed,

Wakeel,

Pasha

et al. 2023

Icame 2023

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“…These Ag 2 In and InSn 4 IMCs assist in nucleating primary β-Sn grains, which could be accountable for the observed hypoeutectic microstructure [5,28]. These results were systematically established by the corresponding findings documented by Hameed et al [29], Mahdavifard et al [30], and Fallahi et al [31], who studied the impact of In on the mechanical property of Pb-free alloys.…”

Section: Microalloying Effects On Mechanical Propertiessupporting

confidence: 60%

Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

Eid,

El-Daly,

Ibrahiem

2024

Phys. Scr.

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The mechanical characteristics of Sn-1.5Ag-0.5Cu (SAC155) alloy modified with In, Bi, and Te microalloying are investigated in relation to three strengthening mechanisms that withstand coarsening: i) micron-scale Ag3Sn, Cu6Sn5, SnTe, Ag2In and InSn4 IMC precipitated phases, ii) Bi in solid solution and iii) Bi precipitated particles formed upon eutectic solidification. Compared to SAC155 alloy with a single strengthening mechanism, the combined effect of threedeformation processes operating in SAC(155)-3Bi-2In with high In content and SAC(155)-3Bi-0.2Te (wt%) with low Te content alloys greatly improved the mechanical properties at high temperatures. It was found that, despite a discernible reduction in ductility, the high In content could refine the microstructure,enrich the elastic modulus (E), yield stress (YS), and ultimate tensile strength (UTS) of SAC(155)-3Bi-2In to almost 2.3 times that of SAC155 solder. On the other hand, a low Te content greatly increased SAC(155)-3Bi-0.2Te's mechanical strength ⁓2.3 times, while a large atomic size difference between Te and Sn atoms caused excessive misfit strain, which in turn increased Bi's solubility in β-Sn grains, and improved ductility by approximately twice that of SAC(155)-3Bi-2In solder.

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“…Figure 9 shows the top view of the fractured surface of as-reflowed and aged SAC 305-ZrO 2 A/Cu joints after the shear test. When tensile or shear tests are conducted on solder joints, fracture propagation mainly occurs in three general modes [22,[32][33][34]. Mode 1-A typical ductile fracture where the cracks start at the solder/Cu joint and propagates within the solder.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 99%

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

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High stability and aging resistance Sn-1Ag-0.5Cu solder alloy by Fe and Bi minor alloying

Cited by 25 publications

References 27 publications

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Analysis of Mechanical Strength of Indium-Doped SAC 105 Lead-Free Solder Alloy

Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

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