High temperature CoSb3–Cu junctions

Wojciechowski, K.; Zybała, Rafał; Mania, R.

doi:10.1016/j.microrel.2011.03.033

Cited by 52 publications

(30 citation statements)

References 10 publications

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“…Krzysztof Tomasz adopted Ni, Mo and Cr 80 Si 20 as the barrier layer in the SKD-Cu junctions, but the mismatched coefficient of thermal expansion (CTE) led to a potential mechanical problem [15]. Zhao et al reported the SKD-metal junctions, in which the electrode was made of Mo-Cu or W-Cu alloy and was jointed to SKD using Ti as the diffusion barrier [16,17].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and reliability evaluation of Yb0.3Co4Sb12/Mo–Ti/Mo–Cu/Ni thermoelectric joints

Fan

Shi

et al. 2015

Ceramics International

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Section: Introductionmentioning

confidence: 99%

Fabrication and reliability evaluation of Yb0.3Co4Sb12/Mo–Ti/Mo–Cu/Ni thermoelectric joints

Fan

Shi

et al. 2015

Ceramics International

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“…17,18 The lifetime and the reliability of thermoelectric modules are also important. 19 Another aspect is materials that could provide heat transport from the heat source and to the heat sink.…”

Section: 3mentioning

confidence: 99%

Method and Apparatus for Determining Operational Parameters of Thermoelectric Modules

Zybała

Schmidt

Kaszyca

et al. 2016

Journal of Elec Materi

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The main aim of this work was to construct and test an apparatus for characterization of high temperature thermoelectric modules to be used in thermoelectric generator (TEGs) applications. The idea of this apparatus is based on very precise measurements of heat fluxes passing through the thermoelectric (TE) module, at both its hot and cold sides. The electrical properties of the module, under different temperature and load conditions, were used to estimate efficiency of energy conversion based on electrical and thermal energy conservation analysis. The temperature of the cold side, T c , was stabilized by a precise circulating thermostat (£0.1°C) in a temperature range from 5°C to 90°C. The amount of heat absorbed by a coolant flowing through the heat sink was measured by the calibrated and certified heat flow meter with an accuracy better than 1%. The temperature of the hot side, T h , was forced to assumed temperature (T max = 450°C) by an electric heater with known power (P h = 0-600 W) with ample thermal insulation. The electrical power was used in calculations. The TE module, heaters and cooling plate were placed in an adiabatic vacuum chamber. The load characteristics of the module were evaluated using an electronically controlled current source as a load. The apparatus may be used to determine the essential parameters of TE modules (open circuit voltage, U oc , short circuit current, I sc , internal electrical resistance, R int , thermal resistance, R th , power density, and efficiency, g, as a function of T c and T h ). Several commercially available TE modules based on Bi 2 Te 3 and Sb 2 Te 3 alloys were tested. The measurements confirmed that the constructed apparatus was highly accurate, stable and yielded reproducible results; therefore, it is a reliable tool for the development of thermoelectric generators.

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“…16,17 These issues are not limited to PbTe but are present in other TE materials as well, such as CoSb 3 -based materials. 18,19 Severe diffusion and the brittleness of the chemical reaction products will undoubtedly lead to degradation of thermoelectric performance, which causes reliability problems during high-temperature operation. Consequently, appropriate bonding materials and fabrication methods should be developed for PbTe thermoelectric modules to allow for reliable long-term operation.…”

Section: Introductionmentioning

confidence: 99%

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials

Drymiotis

Liao

et al. 2015

J. Mater. Chem. C

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The development of reliable bonding materials for PbTe-based thermoelectric modules that can undergo long-term operations at high temperature is carried out. Two cost-effective materials, Cu and Ag, are isothermally hot-pressed to PbTe-based thermoelectric materials at 550 1C for 3 h under a pressure of 40 MPa by the rapid hot-pressing method. Scanning electron microscopy, electron probe micro-analysis, and X-ray diffraction analysis are employed to identify intermetallic compounds, chemical reactions, and microstructure evolution after the initial assembly and subsequent isothermal aging at 400 1C and 550 1C. We find that Cu diffuses faster than Ag in PbTe. Neither Cu nor Ag is a good bonding material because they both react vigorously with Pb 0.6 Sn 0.4 Te. In order to be able to use Cu electrodes, it would be necessary to insert a diffusion barrier to prevent Cu diffusion into PbTe.

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High temperature CoSb3–Cu junctions

Cited by 52 publications

References 10 publications

Fabrication and reliability evaluation of Yb0.3Co4Sb12/Mo–Ti/Mo–Cu/Ni thermoelectric joints

Fabrication and reliability evaluation of Yb0.3Co4Sb12/Mo–Ti/Mo–Cu/Ni thermoelectric joints

Method and Apparatus for Determining Operational Parameters of Thermoelectric Modules

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials

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