High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste

Chen, Jia; Li, Xin; Yafei, Kong; Yunhui, Mei; Guo-Quan, Lu

doi:10.3788/fgxb20163709.1159

发光学报

2016

DOI: 10.3788/fgxb20163709.1159

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High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste

Jia Chen¹,

Xin Li²,

Kong Yafei³

et al.

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High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste

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