High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications

Whitaker, Bret; Cole, Zach; Passmore, Brandon; Martin, Drew; McNutt, Ty; Lostetter, Alexander B.; Ericson, M.N.; Frank, S.S.; Britton, C.L.; Marlino, Laura D.; Mantooth, Alan; Francis, Matt; Lamichhane, Ranjan; Shepherd, Paul; Glover, Michael D.

doi:10.1109/wipda.2014.6964620

Cited by 18 publications

(4 citation statements)

References 11 publications

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“…With a similar approach, Arkansas Power Electronics International (APEI) introduced another gate driver integrated SiC power module designed for a bridgeless-boost converter used as a battery charger for electrified vehicles [86]. Fig.…”

Section: A System Integrationmentioning

confidence: 99%

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Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Section: A System Integrationmentioning

confidence: 99%

“…18. DBC based gate driver integrated modules [82], [86]. In [87], the gate driver ICs, the current sensors, and the ceramic capacitors are co-packaged on a planar structure.…”

Section: A System Integrationmentioning

confidence: 99%

Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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“…The first award was presented in 2009 for NCREPT's work on a high-temperature silicon carbide (SiC) Power Module [4]. In 2014, NCREPT received the award for a high-performance silicon carbide-based plug-in hybrid electric vehicle battery charger [5]. In 2016, NCREPT won its third R&D 100 award for its wide bandgap automotive traction inverter [6].…”

Section: Introductionmentioning

confidence: 99%

The National Center for Reliable Electric Power Transmission Test Facility

Corbitt,

Schwartz,

Farnell

et al. 2024

IEEE Open J. Power Electron.

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Globally, new technological solutions are being studied and developed by researchers in the field of power and energy systems. Before these solutions can be integrated into society as marketable products, thorough testing and validation of the design must be conducted. The National Center for Reliable Electric Power Transmission (NCREPT) is a unique high-power test facility located at the University of Arkansas, Fayetteville, AR, USA. NCREPT is a 12,000-square-foot laboratory space capable of testing power levels up to 6 MVA and offers testing at both the 480 V and 13.8 kV levels. NCREPT's capabilities expand outside of the scope of simply high-power testing. NCREPT has also supported experimental testing for transportation electrification, hardware-in-the-loop, and cybersecurity applications. NCREPT has personnel with experience testing new technologies and has demonstrated its innovative approaches by being a part of four R&D 100 award-winning projects. This paper gives an extensive overview of NCREPT, highlighting its significance as a state-of-the-art testing laboratory.INDEX TERMS cybersecurity, hardware-in-the-loop, high-power test facility, measurement, medium voltage, power and energy, testing, transportation electrification, safety.

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“…Some in particular (e.g. [6][7][8][9][10][11][12][13]) implement the power stage with specific 3D power packages, but do not integrate mixed analog and digital circuits, as required for closed-loop readback mechanisms in this work.…”

Section: Introductionmentioning

confidence: 99%

Towards an LTCC SiP for Control System in Safety-Critical Applications

Nobert

Alameh

et al. 2021

2021 IEEE International Symposium on Circuits and Systems (ISCAS)

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This paper presents a compact configurable power control system for safety-critical applications, which operates in harsh environments. This heterogeneous integrated mixed digital, analog and high-voltage design for power applications is implemented in a system-in-package (SiP) module using a lowtemperature co-fired ceramics (LTCC) substrate. A comparison between technologies for SiP designs shows that LTCC is advantageous in terms of integration density, thermal and electrical performances, as well as signal and power integrity. In addition, this work proposes layout and fabrication techniques for the enhancement of thermal, electrical performances and integration density specific to LTCC-based designs, such as chipcovering, multi-layer routing of power signals and self-damped transmission lines. An improvement of 59% in available area, 32% reduction of temperature due to self-heating, 65% loss reduction and 22% reduction in interference coupling were obtained when compared to a baseline design.

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High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications

Cited by 18 publications

References 11 publications

Automotive Power Module Packaging: Current Status and Future Trends

Automotive Power Module Packaging: Current Status and Future Trends

The National Center for Reliable Electric Power Transmission Test Facility

Towards an LTCC SiP for Control System in Safety-Critical Applications

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