High Thermally Stable Anthracene-Based Polyimides with Low Dielectric Constants and Dissipation Factors

Abstract

At present, high-performance polymers with low dielectric constants (D k ) and low dissipation factors (D f ) have gained much attention with the rapid evolution of microelectronic and 5G communication technologies. Due to their excellent thermal stabilities, heat resistances, mechanical strengths, and dielectric properties, polyimides (PIs) have attracted a lot of attention. Herein, a series of anthracene (An)-based PIs are synthesized from an ester-functionalized anthracene diamine (An-NH 2 ) monomer and four kinds of commercial dianhydrides such as keto (3,3′,4,4′benzophenonetetracarboxylic dianhydride (BTDA)), sulfone (3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA)), fluoro (4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA)), and ether (4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) (BPADA) and 4,4oxydiphthalic anhydride (ODPA)) functional groups by a two-step process, i.e., the chemical polyaddition followed by thermal imidization. The resulting An-NH 2 /BTDA, An-NH 2 /DSDA, An-NH 2 /6FDA, An-NH 2 /BPADA, and An-NH 2 /ODPA PIs are denoted as AnBT-PI, AnDS-PI, An6F-PI, AnBPA-PI, and AnOD-PI, respectively. As a result, all An-based PI films display excellent thermal properties, with thermal decomposition temperatures of 450−530 °C (T d5% weight loss) and glass transition temperatures (T g ) of 270−410 °C. In addition, these PI films exhibit decent optical transparency, flexibility, coefficient of thermal expansion (CTE), and mechanical properties. Remarkably, all An-based PI films show excellent dielectric properties with a low D k of 2.540−3.388 and a D f of 0.0059−0.0240 at high frequency (10 GHz). In particular, the Anbased PI films with ether linkages (AnOD-PI and AnBPA-PI) and a high fluorine content (An6F-PI) show low D k and D f values compared with those with keto (AnBT-PI) and sulfone (AnDS-PI) linkages. These results indicate that the An-based PIs are promising candidates for achieving low D k and D f values at higher frequencies. Overall, we believe this study will provide useful guidelines for the further structural development of An-based PIs with low D k and D f .

Low reflective index, highly transparent, and ultra-low dielectric constant materials prepared via effective copolymerization of 4-methyl-1-pentene and a Si-containing α,ω-diolefin

“…5D illustrates the dielectric constant and dielectric loss values for several common materials. 43–48 Among them, CP-93 prepared in this study, showed the lowest dielectric constant and dielectric loss values. In addition, the lower raw material cost of P(MP- co -DSH)s and the low density (0.835) of PMP polymers effectively reduce material cost.…”

Rigid Photosensitive Polyimide Significantly Improves the Comprehensive Performance of UV-Curing Epoxy Acrylic Resins

“…We believe that this polymer cross-linker should have excellent properties and thus become a good auxiliary material for EA resins. In recent reports, polyimides are known for their excellent thermal stability, , good mechanical properties, and chemical resistance, , and polyimides are highly designable in terms of their functionality. − Among them, photosensitive polyimides can be cured under UV-light, , and the modification of EA resins with photosensitive polyimides is a valid method to improve the mechanical and thermomechanical properties of resins.…”