High volume jet and flash imprint lithography for discrete track patterned media

Ye, Zhengmao; Ramos, Rick; Brooks, Cynthia B.; Hellebrekers, Paul; Carden, Scott; LaBrake, Dwayne

doi:10.1117/12.849226

Cited by 20 publications

(14 citation statements)

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“…Nanoimprint lithography (NIL) is a promising technique for nanopattern fabrication of future magnetic and semiconductor devices [1][2][3][4] because it can easily transfer sub-20-nm scale structures at room temperature. Acrylate-based formulations are widely investigated as NIL resists 5-10 because the polymerization of acrylate is very fast and many acrylate compounds are commercially available.…”

Section: Introductionmentioning

confidence: 99%

Design considerations for ultraviolet-nanoimprint lithography resists

Usuki

Wakamatsu

Oomatsu

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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Design considerations for ultraviolet-nanoimprint lithography resists were investigated focusing on the major issues of ink-jetting performance, pattern formability, release property, and dry etching resistance. Regarding ink-jetting performance, small droplet ink-jetting of 0.7 pl was successfully demonstrated by adjusting the resist fluid property to the ink-jet coater and controlling the resist volatilization. Regarding pattern formability, a resist pattern was imprinted from a mold pattern of 28 nm in width and 60 nm in depth without pattern dimension change. It was thought that modulus control of the resist was more important than resist shrinkage in achieving excellent pattern formability. As for release property, resist with fluorine monomer and with nonreactive fluorine antisticking agent were compared. The results indicated that resist design has the capability to both reduce separation force and maintain a clear mold surface. The mold release agent decomposed with an increasing number of imprint shots, but the low release-force resist with nonreactive antisticking agent was able to control degradation of the mold release agent and thus improve release property endurance. Regarding etching resistance, it was found that increasing the ring parameter of resist is essential for high etching resistance, and resulted in improved etched pattern features of the substrate.

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Section: Introductionmentioning

confidence: 99%

Design considerations for ultraviolet-nanoimprint lithography resists

Usuki

Wakamatsu

Oomatsu

et al. 2012

J. Micro/Nanolith. MEMS MOEMS

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show abstract

“…Nano-imprint lithography (NIL) is a promising technique for nano-pattern fabrication of future magnetic and semiconductor devices [1][2][3][4] because it can easily transfer sub-20nm scale structures at room temperature. Acrylate-based formulations are widely investigated as NIL resists [5][6][7][8][9] because a polymerization of acrylate is very fast and many acrylate compounds are commercially available.…”

Section: Introductionmentioning

confidence: 99%

Design of Release Interface for UV-NIL Material

Usuki

Goto

2016

J. Photopol. Sci. Technol.

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Release interface between UV-NIL resists and quartz mold was investigated focusing on surface energy and elastic modulus of resist film in order to improve release property of UV-NIL process. The resist with fluorine monomer and with non-reactive fluorine anti-sticking agent were compared by separation force measurements and surface analyses of release interface. The results indicated that resist design has the capability to both reduce the separation force and maintain a clear mold surface. The mold release agent decomposed with increasing number of imprint shots, but the low release force resist with non-reactive anti-stacking agent was able to control the degradation of mold release agent and thus improve release property endurance. In addition, resists with various acrylate monomer structures and formulations were studied in terms of elastic modulus of UV cured resist film. It is found that the separation force can also be controlled by resist elastic modulus without depending on the effect of anti-sticking agent.

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“…Its applicability to, for example, semiconductors, 2) patterned media, 3,4) metamaterials, 5,6) solar cells, 7,8) and photonic crystals, 9,10) is demonstrated. UV-NIL comprises mainly two processes: nanoimprinting and lithography.…”

Section: Introductionmentioning

confidence: 99%

“…Ultraviolet nanoimprint lithography (UV-NIL) 1) has received much attention because it is a nanofabrication method industrially acceptable from the viewpoint of throughput and cost. Its applicability to, for example, semiconductors, 2) patterned media, 3,4) metamaterials, 5,6) solar cells, 7,8) and photonic crystals, 9,10) is demonstrated. UV-NIL comprises mainly two processes: nanoimprinting and lithography.…”

Section: Introductionmentioning

confidence: 99%

Reverse-tone ultraviolet nanoimprint lithography with fluorescent UV-curable resins

Uehara

Kubo

Nakagawa

2015

Jpn. J. Appl. Phys.

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The usefulness of fluorescent ultraviolet (UV)-curable resins for reverse-tone UV nanoimprint lithography was demonstrated. Nanoimprinted concave patterns were fabricated as an underlayer on a Au-deposited substrate using a fluorescent UV-curable resin with a low etching durability after curing. The underlayer was coated with another fluorescent UV-curable resin with a high etching durability after curing. Fluorescence microscopic observation allowed the inspection of the morphological uniformity and thickness of both under and top layers in a nondestructive manner. UV-curing of the top layer in combination with pressing with a flat substrate was necessary for obtaining a flattened top layer surface, which was responsible for allowing the reverse-tone UV nanoimprint lithography. We demonstrated the fabrication of 10-nm-thick Au split-ring resonator structures with a line width of 55 + 4 nm corresponding to the underlayer concave resist patterns by dry etching during Ar ion milling under the condition that the etching rate ratio of the underlayer to the top layer was 6.

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High volume jet and flash imprint lithography for discrete track patterned media

Cited by 20 publications

References 0 publications

Design considerations for ultraviolet-nanoimprint lithography resists

Design considerations for ultraviolet-nanoimprint lithography resists

Design of Release Interface for UV-NIL Material

Reverse-tone ultraviolet nanoimprint lithography with fluorescent UV-curable resins

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