Highly Rigid and Functional Polyimides Based on Noncoplanar Benzimidazolone Diamines and Their Photolithography Application

Abstract

It is of significance to develop a photosensitive polyimide for the demand of further integration and miniaturization of integrated circuits. In the current work, the rigid benzimidazolone-derived diamines and the corresponding photosensitive polyhydroxyimide were successfully developed. All polyimides exhibit excellent processability and comprehensive physical properties. Especially, our fluorinated polyhydroxyimide has all the desirable properties for a patterning process which includes high glass transition temperature (369 °C), low dielectric constant (2.94 at 1 MHz), and excellent optical transparency (λ cutoff as low as 332 nm). Based on this fluorinated polyhydroxyimide, our photosensitive polyimide has a sensitivity of 172 mJ cm −2 and a contrast of 4.2, and fine positive patterns with resolutions of 5 and 10 μm were achieved. This provides a feasible framework for expanding the application of benzimidazolone polyimide.