Hot spot aware microchannel cooling add-on for microelectronic chips in mobile devices

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

“…Nevertheless, as these regions are typically localized, maintaining constant large flow rates across all cooled devices can result in overcooled systems. Various attempts implementing single-phase liquid cooling have been made to redirect the coolant to the most demanding zones while reducing the required pumping power [23][24][25]. For example, some authors proposed the use of a cold plate with variable microchannel width or pin-fin density to effectively dissipate high heat fluxes from small areas and achieved reduced thermal gradients at the package level with low-pressure drop, especially when combining this system with a central inlet and two side outlets [26][27][28][29][30].…”

Numerical parametric study of a hotspot-targeted microfluidic cooling array for microelectronics

“…Attempts using single phase liquid cooling have also been reported with different degree of success [18]. Among the major findings in the literature, one can note that power densities larger than 400 W/cm² can be extracted with micro-channel single-phase conditions [19,20]. However, they are not able to provide a good temperature uniformity that preserves the reliability and efficiency of the cooled device.…”

“…Model predictions suggested the capability of this design to remove hotspot heat fluxes up to 300 W/cm 2 , the microchannel design is based in the worst operating conditions with maximum heat flux on each hot spot simultaneously, in combination with a background heat flux of 20 W/cm 2 and a pressure drop below 35 kPa. Localized microchannels where shown by Collin et al [20] to achieve high local heat flux of 1185 W/cm 2 with a pressure drop below 20 kPa. Nevertheless, these cooling devices do not tailor their behavior to the time-dependent heat load scenarios.…”