2021 5th IEEE Electron Devices Technology &Amp; Manufacturing Conference (EDTM) 2021
DOI: 10.1109/edtm50988.2021.9420903
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HTRB & THB Reliability Improvement Using Capping Layer in Power Discrete Trench Devices

David Goh
1
,
W. J. Chen
2
,
Farooq A. Tahir
3
et al.
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