Hybrid 3d integrated circuits at millimeter-wave frequencies — advantages and trends

Abstract

The implementation of passive RF functions is usually done by means of coplanar waveguides at mm-wave fre quencies. We propose original solutions for improving their reliability, by integrating the parasitic mode filters as dielectric bridges through a 3D integration approach. Furthermore, original compensating methods are propo sed in order to control the cut-off frequencies induced by the bounding networks.The 3D hybrid approach can also be efficiently used so as to accommodate the association between active, passive and radiating components. The 3D-CPW techno logy is therefore completed with Thin Film MicroStrip configurations (TFMS), while composite ceramic/foam architectures become thinkable for radiating arrays.