Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity

Xue-li, 范学丽 Fan; Rui-kuan, 靖瑞宽 Jing; Chao, 翁 超 Weng; Qi-xing, 陈启省 Chen; Yan-ming, 王晏酩 Wang; Hong-xi, 肖红玺 Xiao; Huan-ping, 刘还平 Liu

doi:10.3788/yjyxs20163101.0067

液晶与显示

2016

DOI: 10.3788/yjyxs20163101.0067

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Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity

范学丽 Fan Xue-li¹,

靖瑞宽 Jing Rui-kuan²,

翁超 Weng Chao³

et al.

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P‐65: Misty Mura Defect of OGM Products Research

Li¹,

Zhong-zheng²,

Guo³

et al. 2019

Symp Digest of Tech Papers

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The misty mura defect of OGM products seriously affects the product appearance yield. It was found that the misty mura is caused by insufficient adhesion of the photoresist. In this paper, etch and photo process conditions were optimized and verified. We found that extending the metal photo oven time and increasing temperature can significantly decrease the misty Mura level. In addition, adding anneal (140 °C, 15min) after photo oven, the misty mura can be completely alleviated without any other problems at the same time.

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P‐65: Misty Mura Defect of OGM Products Research

Li¹,

Zhong-zheng²,

Guo³

et al. 2019

Symp Digest of Tech Papers

View full text Add to dashboard Cite

show abstract

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Improvement of etching uniformity and influence factors of wet etching of FI CD uniformity

Cited by 1 publication

References 0 publications

P‐65: Misty Mura Defect of OGM Products Research

P‐65: Misty Mura Defect of OGM Products Research

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