Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing

Choi, Won-Jun; Yoo, Myong Jae; Bae, Joonho; Seo, Ji-Hun; Lee, Churl Seung

doi:10.1109/tsm.2024.3378160

IEEE Trans. Semicond. Manufact.

2024

DOI: 10.1109/tsm.2024.3378160

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Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing

Won-Jun Choi,

Myong Jae Yoo,

Joonho Bae

et al.

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Study of the impact of flake Al2O3 abrasive and N-n-butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers

Du,

Wang,

Chen

et al. 2025

Surfaces and Interfaces

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Study of the impact of flake Al2O3 abrasive and N-n-butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers

Du,

Wang,

Chen

et al. 2025

Surfaces and Interfaces

View full text Add to dashboard Cite

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Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing

Cited by 1 publication

References 26 publications

Study of the impact of flake Al2O3 abrasive and N-n-butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers

Study of the impact of flake Al2O3 abrasive and N-n-butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers

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