2019
DOI: 10.1108/mi-12-2018-0077
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In depth study of lead frame tape residuein quad flat non-leaded package

Abstract: Purpose Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach An experiment using lead frame and tapes from three manufacturer… Show more

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“…Moreover, factors such as thermal stability issues (Peng and Yam, 2019), sub-surface damage and the strength of wafers need to be put under check for increasing the reliable fabrication (Zhong, 2019) of the dies. Otherwise, low reliability or electrical conductivity test failures can render the die useless (Nadaraja and Yap, 2019).…”
Section: Proposed Algorithmmentioning
confidence: 99%
“…Moreover, factors such as thermal stability issues (Peng and Yam, 2019), sub-surface damage and the strength of wafers need to be put under check for increasing the reliable fabrication (Zhong, 2019) of the dies. Otherwise, low reliability or electrical conductivity test failures can render the die useless (Nadaraja and Yap, 2019).…”
Section: Proposed Algorithmmentioning
confidence: 99%