In-plane strains measurement by using the electronic speckle pattern interferometry

KSME International Journal

Jang

Hong

et al. 2000

This study discusses a non-contact optical technique(electronic speckle pattern interferometry) that is well suited for thermal deformation measurement without any surface preparation and compensating process. Fiber reinforced plastics ([0] 16, [0/90J8S) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the transverse direction of a uniaxial composite is evaluated as 48.78 X 10-6 (1/'C ). Also, the thermal expansion coefficient of the cross-ply laminate [0/90J85 is numerically estimated as 3.23 X 10-6 (l/'C) that is compared with that measured by ESPI.

Section: Analysis Of Interferometric Fringementioning

confidence: 99%

“…Some researchers (Shchepinov et al, 1996;Kim et al, 1998;Lq;kberg et al, 1985) proposed an electronic speckle pattern interferometry method (ESPI) that can measure displacements without the preparation of the structure surface. In this study, we used ESPI to measure the thermal strain at high temperature.…”

Section: Introductionmentioning

confidence: 99%

Thermal strain analysis of composite materials by electronic speckle pattern interferometry

KSME International Journal

Jang

Hong

et al. 2000

“…Among them, electronic speckle pattern interferometry (ESPI) is a technique that is very attractive in optical metrology not only for its noncontact nature but also for its relative speed. This is mainly due to the use of video detection and digital image processing [5,6]. The application of digital techniques in ESPI allows the automation of the data analysis process, which is usually based on the extraction of the optical phase distribution encoded by the generated correlation fringes.…”

Section: Introductionmentioning

confidence: 99%

Residual stress measurement on the butt-welded area by electronic speckle pattern interferometry

Nuclear Engineering and Technology

Choi

et al. 2015

“…To find the practical aspect of these problems, we have measured the vibration modes of rectangular plates clamped at two parallel edges by ESPI (Cloud, 1995;Ennos, 1975;Jones and Wykes, 1989), which is developed in recent years. ESPI (Electronic Speckle Pattern Interferometry) (Kang and Moon, 1996;Kim and Yang, 1994;Kim et a\., 1998) tion and the computer image processing to SPI, is a new method for the analysis of the vibration problems (Kang and Choi, 1996;Rastogi, 1997;Sirohi, 1993). In this paper, vibration modes are measured for each excitation point and aspect ratio of the specimen.…”

Section: Introductionmentioning

confidence: 99%

Experimental analysis of vibration modes of plates using ESPI

KSME International Journal

Jung

Kang

et al. 1999

Self Cite

In the world, there are several types of vibration, and these vibrations especially affect the mechanical industry. In this paper, experimental analysis of vibration modes of plates is discussed. Electronic speckle pattern interferometry (ESPI) is one of the optical nondestructive testing techniques. By using the ESPI, vibration modes of plates with various excitation points, ratio of longitudinal and lateral length, and materials are measured and qualitatively compared with the results of theoretical analysis proposed by Warburton. Finally, these vibration modes are quantitatively compared with the result of FEM analysis. The results of this study are as follows: (I) By comparing the theoretical and experimental frequencies, we confirmed qualitatively that deviations of frequencies are within 10% in accuracy.(2) By comparing the experimental vibration mode shapes with the numerical ones of the FEM analysis, we can conclude quantitatively that measuring vibration modes by using the ESPI has high accuracy.