Abstract:As die feature sizes continue to decrease, advanced process control has become essential for controlling profile and CD uniformity across the wafer. Gate CD variation must be suppressed by process optimization of lithography, photoresist trim, and gate etch in order to achieve the demanding CD control tolerances. Currently, APC is used in the lithography and etch processes for within wafer (WiW) and wafer-to-wafer (W2W) CD control. APC can make improvements in process results, but there is still variation that… Show more
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