Influence of different crosslinking systems on the mechanical and morphological properties of thermoplastic vulcanizates

Patermann, Simone; Altstädt, Volker

doi:10.1063/1.4918492

Cited by 3 publications

(1 citation statement)

References 4 publications

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“…The most widely used crosslinking agents for EPDM/PP TPVs are peroxides and phenolic resins [ 19 , 20 , 21 ]. Dynamically vulcanization of the EPDM phase in the EPDM/PP system with peroxides has been well-known for many years.…”

Section: Introductionmentioning

confidence: 99%

Unlocking the Potential Use of Reactive POSS as a Coagent for EPDM/PP-Based TPV

et al. 2023

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Thermoplastic vulcanizates (TPVs) are multifunctional materials consisting of two or more phases with solid elastomeric properties at room temperatures and fluid-like properties above their melting point. They are produced through a reactive blending process known as dynamic vulcanization. The most widely produced TPV type is ethylene propylene diene monomer/polypropylene (EPDM/PP), which is the focus of this study. The peroxides are mainly selected to be used in crosslinking of EPDM/PP-based TPV. However, they still have some disadvantages, such as the side reactions resulting in the beta chain scission of the PP phase and undesired disproportionation reactions. To eliminate these disadvantages, coagents are used. In this study, for the first time, the use of vinyl functionalized polyhedral oligomeric silsesquioxane (OV-POSS) nanoparticles was investigated as a potential coagent in EPDM/PP-based TPV production via peroxide-initiated dynamic vulcanization. The properties of the TPVs having POSS were compared with the conventional TPVs containing conventional coagents, such as triallyl cyanurate (TAC). POSS content and EPDM/PP ratio were investigated as the material parameters. Mechanical properties of EPDM/PP TPVs exhibited higher values in the presence of OV-POSS, which resulted from the active participation of OV-POSS into the three-dimensional network structure of EPDM/PP during dynamic vulcanization.

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Section: Introductionmentioning

confidence: 99%

Unlocking the Potential Use of Reactive POSS as a Coagent for EPDM/PP-Based TPV

et al. 2023

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Physical and mechanical properties of vulcanized and filled rubber at high strain rate

Yan,

Zaoui,

Zaïri

2023

Chinese Journal of Physics

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Manufacturing of Elastomeric Substrates for Stretchable Printed Electronics

Deshmukh

Keaney

Barry

et al. 2022

Rubber Chemistry and Technology

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Stretchable electronics are being used in applications such as wearable electronics, robotic skin, wearable health-monitoring devices, and smart textiles due to their excellent mechanical conformability through stretching, flexing, twisting, and folding. This work focuses on creating printable stretchable substrates based on butyl rubber (IIR), combined with a ferroelectric filler, barium strontium titanate (BST). BST has unique properties, including the ability to tune the dielectric properties by applying a bias to the substrate. A high loading of BST was incorporated to tailor the dielectric properties of the substrate. This work investigated the effect of three different cure systems on the properties, including interaction with a silver ink. For all cure systems, cure and scorch time decreased with increases in BST loading. A phenolic cure did not affect the ink conductivity, whereas the sulfur-cured systems resulted in nonconductive ink. For the phenolic-cured substrate, the tensile strength increased and the elongation decreased with increasing filler loading. The elastomer could be filled with up to 40 vol. % BST while still maintaining elongation greater than 200%.

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Influence of different crosslinking systems on the mechanical and morphological properties of thermoplastic vulcanizates

Cited by 3 publications

References 4 publications

Unlocking the Potential Use of Reactive POSS as a Coagent for EPDM/PP-Based TPV

Unlocking the Potential Use of Reactive POSS as a Coagent for EPDM/PP-Based TPV

Physical and mechanical properties of vulcanized and filled rubber at high strain rate

Manufacturing of Elastomeric Substrates for Stretchable Printed Electronics

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