Influence of driving method on discharge mode of damage free remote plasma removal process for semiconductor manufacturing

Cho, Tae S.; Han, Qing; Park, Soonam; Lubomirsky, Dima; Venkataraman, S.

doi:10.1109/plasma.2016.7534008

2016 IEEE International Conference on Plasma Science (ICOPS) 2016

DOI: 10.1109/plasma.2016.7534008

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Influence of driving method on discharge mode of damage free remote plasma removal process for semiconductor manufacturing

Tae S. Cho

Qing Han

Soonam Park

et al.

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Influence of driving method on discharge mode of damage free remote plasma removal process for semiconductor manufacturing

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