Influence of Green Polyhydroxylic Compounds on Copper Nano Thin Film Deposition

Abstract

In this work, we utilized the regular polyhydroxylic complexing agents' saccharose and xylitol to develop an eco-friendly electroless deposition process for copper. The electroless bath used formaldehyde free glyoxylic acid as reducing agent and KOH as the pH adjustor, rather than NaOH, to avoid the development of insoluble by-product. A small volume of the green Bronsted acid, methanesulphonic acid (MSA) was also used in the bath to improve solubility of the copper salts. The surface morphologies and structural property of copper deposits were characterized by SEM, AFM and XRD studies. Pyridine and 2,2-dipyridyl as primary stabilizers in saccharose and xylitol baths were found to influence the deposition rate and thickness of the copper deposits. In the saccharose bath, Pyridine performed as inhibitors and best deposition was obtained at pH of 12.75. 2,2-dipyridyl afforded smoother and shiner deposits than Pyridine. In xylitol bath, both the stabilizers were best deposition occurred at a pH of 13.25 and served as the accelerator and extended the life of the electroless bath.