Influence of package failure on IC's reliability

Abstract

Different packaging materials and packaging forms have different influence on the reliability of devices. For the semiconductor device, failure mode caused by wire bond is up to nearly 49%. Therefore, understanding of the structure characteristics of various packaging and their main failure modes and mechanism has important meaning to improve the reliability of devices being used. In this paper, three kinds of common failure modes and failure mechanism of packaged devices are analyzed. Also, some precautions for reducing such failures are presented.