Proceedings ICT2001. 20 International Conference on Thermoelectrics (Cat. No.01TH8589)
DOI: 10.1109/ict.2001.979874
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Influence of structures and compositions on thermoelectric properties of silicon borides

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(6 citation statements)
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“…In addition, the CVD process shows extraordinary electrical conductivity for boron-rich Si-B systems compared to other melting processes. This confirms the fact that the electrical conductivity is affected by melting, which creates microcracks or inner porosity during the solidification [49].…”
Section: Thermoelectric Properties Of Si-b Systemssupporting
confidence: 75%
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“…In addition, the CVD process shows extraordinary electrical conductivity for boron-rich Si-B systems compared to other melting processes. This confirms the fact that the electrical conductivity is affected by melting, which creates microcracks or inner porosity during the solidification [49].…”
Section: Thermoelectric Properties Of Si-b Systemssupporting
confidence: 75%
“…(8) and 9, we obtain Figure 7: A semi log (Arrhenius-type) plot of ln (σ) versus T −1 : SPS SiB 6 + SiB n [45], SPS SiB n [45], AM SiB 6 + SiB n [45], AM SiB n [45], AM-SiB 6 [46], AM-SiB 4 + SiB 6 [46], Sintering [47], CVD SiB 6 [48], CVD SiB 4 [48], CVD SiB n (B/Si = 60) [49], CVD SiB n (B/Si = 48), SPS SiB 6 [50], HP SiB 6 [50], Plasma melting [49], SPS Si 92 B 8 [51]. SPS SiB 6 + SiB n [45], SPS SiB n [45], AM SiB 6 + SiB n [45], AM SiB n [45], AM-SiB 6 [46], AM-SiB 4 + SiB 6 [46], Sintering [47], CVD SiB 6 [48], CVD SiB 4 [48], CVD SiB n (B/Si = 60) [49], CVD SiB n (B/Si = 48), SPS SiB 6 [50], HP SiB 6 [50], Plasma melting [49], SPS Si 92 B 8 [51]. Figure 9: A semi-log (Arrhenius-type) plot of ln k versus T −1 : SPS SiB 6 + SiB n [45], SPS SiB n [45], AM SiB 6 + SiB n [45], AM SiB n [45], AM-SiB 6 [46], AM-SiB 4 + SiB 6 [46], Sintering [47], CVD SiB 6 [48], CVD SiB 4 [48], SPS Si 92 B 8 [51].…”
Section: Thermoelectric Properties Of Si-b Systemsmentioning
confidence: 99%
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