Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Xu, Huining; Liu, Changqing; Silberschmidt, Vadim V.; Chen, Zhong; Wei, Jun

doi:10.1016/j.jmatprotec.2010.02.012

Cited by 26 publications

(12 citation statements)

References 20 publications

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“…This finding is in agreement with the results obtained by Lum et al [3]. Xu et al [4] also indicated that metallurgical bonding is initiated at the periphery of the interface between the ball and pad in the direction of ultrasonic vibration and that the bonding area grew towards the centre of the contact area with increasing ultrasonic power. They reported that the relative motion at the bonding interface also changed from gross sliding to microslip when the bonding force was increased.…”

Section: Lift-off or Footprint Morphology Analysissupporting

confidence: 92%

“…Xu et al [4,5] extended the work done by Harman and Albers [1] and also Lum et al [3]. They carried out experiments to analyse the effects of ultrasonic power, bonding force and bonding time parameters on the footprint morphology of the Au ball bond and Al bond pad.…”

Section: Lift-off or Footprint Morphology Analysismentioning

confidence: 99%

“…Again, fractured microwelds attached to the footprint area were used as an indicator of metallurgical bonding. Xu et al [4] reported that the relative motion at the interface between the ball bond and bond pad changes from microslip to gross sliding when the ultrasonic power is increased. This finding is in agreement with the results obtained by Lum et al [3].…”

Section: Lift-off or Footprint Morphology Analysismentioning

confidence: 99%

“…There are three types of wire bonding technologies that have been used in industry: thermocompression bonding, ultrasonic wedge bonding and thermosonic bonding. Thermosonic bonding is normally used in industry to weld the Au wire onto the substrate metallisation or bond pad [1] and involves combinations of several processes such as mechanical force, heat and ultrasound [2][3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

“…However, the results obtained from the various methods suggest that different types of mechanisms control thermosonic Au wire bonding. Some of the methods, namely footprint morphology, intermetallic coverage, microstructural and frictional bonding analyses, have concluded that solid-state diffusion is the main mechanism of thermosonic Au wire bonding [1,[3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. However, a new possible bonding mechanism (liquid-state diffusion) has been proposed based on TEM examinations [27][28][29][30].…”

Section: Introductionmentioning

confidence: 99%

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Some thoughts on bondability and strength of gold wire bonding

et al. 2012

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The bonding mechanisms of gold, to give the desired strength of wire bonding, still require detailed investigation, including establishing adequate and reliable testing procedures. The current practices for analysing the mechanisms of wire bonding are inadequate and do not provide a comprehensive picture. This is because the focus of the tests is not clear, which causes variation in the results obtained, changing the conclusions about the responsible mechanism. Furthermore, as the size of Au wire bonds decreases, the mechanism responsible for thermosonic Au wire bonding may change. This paper provides a comprehensive analysis of the current and possible future methods for elaborating the bonding mechanism and strength of thermosonic Au wire bonds. We discuss the testing methods, their limitations and advantages, and suggest ways in which they can be improved.

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Section: Lift-off or Footprint Morphology Analysissupporting

confidence: 92%