2020
DOI: 10.1016/j.promfg.2020.07.008
|View full text |Cite
|
Sign up to set email alerts
|

Inspection of electronic component using pulsed thermography

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2022
2022

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 18 publications
0
1
0
Order By: Relevance
“…Cell phones have embedded hardware, beyond the wireless devices, that also have nonlinearity and manufacturing imperfections that might be leveraged as identifiers, including the audio system digital to analog converter (DAC) and the analog to digital converter (ADC) and the camera sensor array [85]. Other possible fingerprint features include IoT network behavior [103], power supply current in both integrated circuits and fully integrated IoT devices [104][105][106], and thermal behavior [107].…”
Section: Fingerprints Identifiers and Classifiersmentioning
confidence: 99%
“…Cell phones have embedded hardware, beyond the wireless devices, that also have nonlinearity and manufacturing imperfections that might be leveraged as identifiers, including the audio system digital to analog converter (DAC) and the analog to digital converter (ADC) and the camera sensor array [85]. Other possible fingerprint features include IoT network behavior [103], power supply current in both integrated circuits and fully integrated IoT devices [104][105][106], and thermal behavior [107].…”
Section: Fingerprints Identifiers and Classifiersmentioning
confidence: 99%