Integrated Common-Mode Filter for GaN Power Module With Improved High-Frequency EMI Performance

Jia, Niu; Tian, Xingyue; Xue, Lingxiao; Bai, Hua; Tolbert, Leon M.; Cui, Han

doi:10.1109/tpel.2023.3248092

Cited by 15 publications

(5 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In the WBG-based power module package level, parasitic inductances and mutual couplings are usually reduced by better packaging schemes, layouts, and bonding techniques [6], [47]- [48], [92]- [94]. In this section, some other package-level parasitic reduction techniques that can be applied to both single-sided and double-sided cooled power modules are summarized and analyzed [49]- [61]. In addition, all the parasitic and coupling reduction techniques at the package level are identified and compared in terms of their manufacturing complexity in Table I given at the end of the section.…”

Section: Package-level Parasitics Reduction Techniquesmentioning

confidence: 99%

“…The principle of the magnetic flux cancellation is explained in Fig. 17 [55]- [56]. When the current flows in opposite directions through two conductors, the magnetic fluxes have the same direction in the inner area between the conductors, but opposite directions in the outer area.…”

Section: Emi Filter Integrationmentioning

confidence: 99%

“…In [58], [59], CM capacitors are added to the package and realize a good EMI attenuation. References [60], [61] not only include the CM capacitors but also integrate a CM inductor in the power module package as shown in Fig. 18, and show that the package-integrated CMF can obtain more attenuation than the external CMF since different positions of the CMF change the parasitic inductances distribution, affecting the EMI filter's performance.…”

Section: Emi Filter Integrationmentioning

confidence: 99%

“…To realize better space utilization and further improve the power density of the GaN power module package with integrated CMF, [56] developed a package-compatible manufacturing methodology of an air-cured magnetic composite and over-molded the CMF into the WBG package.…”

Section: Emi Filter Integrationmentioning

confidence: 99%

See 3 more Smart Citations

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

Jia,

Xue,

Cui

2024

IEEE Open J. Power Electron.

Self Cite

View full text Add to dashboard Cite

The wide applications of wide-bandgap (WBG) devices in power electronics systems bring benefits in higher switching speed, frequency, and power density, but also cause severe electromagnetic interference (EMI) issues. While many EMI mitigation methods are available to reduce the noise generated from the source (i.e. switching WBG devices), it is equally important to analyze and control the EMI propagation paths. In WBG systems, the parasitic and coupling effects become dominant due to the high switching frequency and the compact system size, which creates uncontrolled propagation paths that degrade the systems' EMI performance significantly. Therefore, it is crucial to investigate the parasitic and coupling effects and develop corresponding mitigation techniques. This review focuses on analyzing the EMI propagation paths to provide a comprehensive guideline to identify possible parasitics and couplings in the power module package level, EMI filter level, and the power electronics system level. The corresponding mitigation techniques for common-mode and differential-mode conducted EMI as well as radiated EMI are summarized, and the remaining challenges and future research topics are also discussed for all three levels in the conclusion.

show abstract

Section: Package-level Parasitics Reduction Techniquesmentioning

confidence: 99%

Section: Emi Filter Integrationmentioning

confidence: 99%

Section: Emi Filter Integrationmentioning

confidence: 99%

Section: Emi Filter Integrationmentioning

confidence: 99%

See 2 more Smart Citations

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

Jia,

Xue,

Cui

2024

IEEE Open J. Power Electron.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Reference [98] integrates CM capacitors into SiC modules to reduce conducted EMI. Similarly, to minimize the filter parasitic effects, Reference [99] integrates the CM filter with the CaN half-bridge power module, as shown in Figure 17. Through this integration technology, up to 50 dB attenuation is achieved in the frequency range of 10 to 100 MHz.…”

Section: Optimization Of Power Densitymentioning

confidence: 99%

A Review of EMI Research of High Power Density Motor Drive Systems for Electric Actuator

Wang,

Jiang,

Liu

et al. 2023

Actuators

View full text Add to dashboard Cite

With the global attention given to energy issues, the electrification of aviation and the development of more electric aircraft (MEA) have become important trends in the modern aviation industry. The electric actuator plays multiple roles in aircraft such as flight control, making it a crucial technology for MEA. Given the limited space available inside an aircraft, the power density of electric actuators has become a critical design factor. However, the pursuit of high power density results in the need for larger rated power and higher switching frequency, which can lead to severe electromagnetic interference (EMI) issues. This, in turn, poses significant challenges to the overall reliability of the electric actuator. This paper provides a comprehensive review of EMI in high power density motor drive systems for electric actuator systems. Firstly, the state of the art of electric actuator systems are surveyed, pointing out the contradictory relationship between high power density and EMI. Subsequently, various EMI modeling approaches of motor control systems are reviewed. Additionally, the main EMI suppression methods are summarized. Active EMI mitigation methods are emphasized in this paper due to their advantages of higher power density compared with passive EMI filters. Finally, the paper concludes by summarizing the EMI research in motor drive systems and offering the prospects of electric actuators.

show abstract

Conducted interference suppression for Switched-Mode power supplies based on an impedance resonance design of piezoelectric ceramics

Zhang,

Yan,

Zhou

2025

AEU - International Journal of Electronics and Communications

View full text Add to dashboard Cite

Integrated Common-Mode Filter for GaN Power Module With Improved High-Frequency EMI Performance

Cited by 15 publications

References 10 publications

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

Mitigating EMI Noise in Propagation Paths: Review of Parasitic and Coupling Effects in Power Electronic Packages, Filters, and Systems

A Review of EMI Research of High Power Density Motor Drive Systems for Electric Actuator

Conducted interference suppression for Switched-Mode power supplies based on an impedance resonance design of piezoelectric ceramics

Contact Info

Product

Resources

About