Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs

DeProspo, Bartlet; Gezgin, Nahid; Watanabe, Arata; Raj, P. Markondeya; Liu, Fuhan; Puckett, Waylon; Graham, Samuel; Tummala, Rao; Byers, Kyle J.; Garrison, Sean

doi:10.1109/ectc.2017.339

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017

DOI: 10.1109/ectc.2017.339

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Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs

Bartlet DeProspo

Nahid Gezgin²,

Arata Watanabe³

et al.

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Cited by 6 publications

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Design and Fabrication of Feasible 3D Optoelectronics Integration Based on Embedded IC Fanout Technology

Liu

Guo²,

She

et al. 2018

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs

Cited by 6 publications

References 6 publications

Design and Fabrication of Feasible 3D Optoelectronics Integration Based on Embedded IC Fanout Technology

Design and Fabrication of Feasible 3D Optoelectronics Integration Based on Embedded IC Fanout Technology

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