Interface characteristics of Si/Si junctions by using surface-activated bonding

yamajo, shoji; Morimoto, M.; Liang, Jianbo; Shigekawa, Naoteru

doi:10.1109/imfedk.2015.7158550

2015 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) 2015

DOI: 10.1109/imfedk.2015.7158550

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Interface characteristics of Si/Si junctions by using surface-activated bonding

shoji yamajo

M. Morimoto

Jianbo Liang

et al.

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Interface characteristics of Si/Si junctions by using surface-activated bonding

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References 4 publications

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