Interfacial Reaction and Mechanical Characterization of Sn–Ag–Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Interfacial Reaction and Mechanical Characterization of Sn–Ag–Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition

Cited by 11 publications

References 32 publications

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder

High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes

Contact Info

Product

Resources

About