Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Li, Jianfeng; Mannan, Samjid H.; Clode, Michael; Liu, C.; Chen, K.; Whalley, D.C.; Hutt, David A.; Conway, Paul

doi:10.1109/tcapt.2008.2001160

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Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Cited by 5 publications

References 22 publications

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints

Influence of Pad Surface Finish on the Microstructure Evolution and Intermetallic Compound Growth in Homogeneous Sn-Bi and Sn-Bi-Ag Solder Interconnects

A review: On the development of low melting temperature Pb-free solders

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