Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

Huang, Xi; Zhang, Liang; Zhang, Jia-Min; Chen, Chen; Lu, Xiao; Sun, Lei

doi:10.1016/j.matchar.2023.113618

Materials Characterization

2024

DOI: 10.1016/j.matchar.2023.113618

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Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

Xi Huang,

Liang Zhang,

Jia-Min Zhang

et al.

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Cited by 8 publications

References 38 publications

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Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Chen,

Hu,

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2024

J Mater Sci: Mater Electron

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Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Chen,

Hu,

Tang

2024

J Mater Sci: Mater Electron

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Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

Huang,

Zhang,

Rao

et al. 2024

Met. Mater. Int.

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Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

Deng,

Zhang,

Chen

et al. 2024

Journal of Materials Research and Technology

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Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging

Cited by 8 publications

References 38 publications

Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging

Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties

Effect of Si3N4 nanoparticles on IMC as well as mechanical properties of Sn58Bi/Cu solder joints during thermal aging

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