Intrinsic AC Dielectric Breakdown Strength of Polyimide Films at the Extreme: New Breakthrough Insights on Thickness Dependence

Abstract

To date, the AC dielectric breakdown strength of polyimide (PI) films, as for most polymers, is understood to follow a thickness dependency with a measured power law exponent, n ≈ 0.5. However, this work experimentally demonstrates that the AC dielectric strength of PI films is quasi‐thickness independent. Evidence is presented showing that the thickness dependency described in the literature can be explained by an extrinsic failure mode, driven by partial discharges occurring at the dielectric‐oil‐electrode triple point. Triple points can be avoided by electrode encapsulation, which subsequently recovers a purely intrinsic failure mode for PI films over a large thickness range. Consequently, the AC dielectric strength of thick PI films is intrinsic and quasi‐thickness independent, at least for film thickness up to 60 µm. For the first time, a “theoretical” AC breakdown field for PI films is reported as ≈520 Vrms µm−1. Finally, the highest experimental breakdown field values are obtained here with 505 Vrms µm−1 and 705 Vµm−1 under AC and DC fields, respectively.