Investigating the electromigration reliability of copper interconnects

Abstract

I would like to give an expression of my heartfelt gratitude to my supervisor, Professor Subodh G. Mhaisalkar, whose guidance and support has always been a source of motivation to me throughout the entire work. During three years of working with him, I learned to explore new ideas and to trust my abilities and intuition. He rendered an encouraging and productive atmosphere for me by accommodating sufficient space for my individualistic decisions as well as made sure that my research work remains on the right track. I take this opportunity to express that my gratitude towards him will remain afresh forever.