Investigation of thermoplastic-modified thermosets: positron annihilation and related studies of an amine-cured epoxy resin

Mackinnon, Alexander J.; Pethrick, Richard A.; Jenkins, Stephen D.; McGrail, P.T.

doi:10.1016/0032-3861(94)90485-5

Cited by 30 publications

(17 citation statements)

References 18 publications

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“…Because of the poor miscibility between epoxy matrix and FHPPO, FHPPO phases separated out and forms dispersed particles during cure. Generally, for immiscible systems, the interfacial boundaries of the matrix and dispersed phase can bring in extra free volumes . However, the phase separation especially large dispersed phases will decrease the interfacial areas between the dispersed phase and the matrix, which is unfavorable for the increase in free volumes .…”

Section: Resultsmentioning

confidence: 99%

Dielectric and mechanical properties of diglycidyl ether of bisphenol a modified by a new fluoro-terminated hyperbranched poly(phenylene oxide)

et al. 2013

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Diglycidyl ether of bisphenol A (DGEBA)/fluoro-terminated hyperbranched poly(phenylene oxide) (FHPPO) composites with improved mechanical and dielectric performances were prepared by blending a FHPPO with DGEBA. The low-polarity building blocks, abundant fluorinated terminal groups, and the inherent free volume brought by FHPPO efficiently lowered the dielectric constant and the dissipation factor. The free volumes of the cured DGEBA/FHPPO composites, which were quantified by positron annihilation lifetime spectroscopy, increased with the FHPPO loading. The moisture absorption of composites also decreased after the introduction of FHPPO due to the hydrophobicity of fluorinated substituents. Dynamic mechanical analysis tests and scanning electron morphology revealed that FHPPO phase separated from the composites during the curing process. The average diameter of dispersed FHPPO particles increased proportionally with the FHPPO loading. Composites with dispersed particle size of around 150 nm showed the best comprehensive mechanical performance. In addition, incorporation of FHPPO, which has lots of aromatic structures, into DGEBA also increased the thermal stabilities. POLYM. COMPOS., 34:1051-1060,

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Section: Resultsmentioning

confidence: 99%

Dielectric and mechanical properties of diglycidyl ether of bisphenol a modified by a new fluoro-terminated hyperbranched poly(phenylene oxide)

et al. 2013

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“…Although epoxy resins can be substantially toughened by the addition of reactive liquid rubbers,4–7 improvements in toughness are inevitably accompanied by the lowering of other good properties, such as the glass‐transition temperature ( T g ) and thermal and oxidative stability. Therefore, an alternative approach has emerged in which epoxy resins are toughened by physical blending with high‐performance engineering thermoplastics, such as poly(ether sulfone),5–7 polysulfone,8, 9 poly(ether ether ketone),10, 11 poly(ether imide) (PEI),12–14 and polyimide 15. Studies have revealed that blending with these thermoplastics can enhance the fracture toughness of epoxy resins without sacrificing the strength, stiffness, T g , or any other desirable properties.…”

Section: Introductionmentioning

confidence: 99%

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

Naffakh

Dumon

Dupuy

et al. 2005

J of Applied Polymer Sci

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International audienceThe cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0-15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/ DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint

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“…Studies on polymeric mixtures comprising a high molecular weight thermoplastic (TP)1–11 and reactive thermosetting resins have significantly increased because of the development of complex morphology as the cure reaction progresses. Various types of TPs, such as poly(ether sulfone) (PES),1, 2 poly(ether imide) (PEI),3, 4, 6 poly(ether ether ketone),3 and polysulfone (PSF),7–11 have been explored to modify epoxy resins. The modifier is initially dissolved in the monomers of the system to be modified; it then phase separates because of an increase in the molecular weight of the thermosetting resin during isothermal cure.…”

Section: Introductionmentioning

confidence: 99%

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. I. Phase diagrams

Giannotti

Foresti

Mondragón

et al. 2004

J Polym Sci B Polym Phys

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Epoxy–aromatic diamine formulations are simultaneously modified with two immiscible thermoplastics (TPs), poly(ether imide) (PEI) and polysulfone (PSF). The epoxy monomer is based on diglycidyl ether of bisphenol A and the aromatic diamines (ADs) are either 4,4′‐diaminodiphenylsulfone or 4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline). The influence of the TPs on the epoxy–amine kinetics is investigated. It is found that PSF can act as a catalyst. The presence of the TP provokes an increase of the gel times. Cloud‐point curves (temperature vs. composition) are shown for epoxy/PSF/PEI and epoxy/PSF/PEI/AD initial mixtures. Phase separation conversions are reported for the reactive mixtures with various TP contents and PSF/PEI proportions. On the basis of phase separation and gelation curves, conversion–composition phase diagrams at constant temperature are generated for both systems. These diagrams can be used to design particular cure cycles to generate different morphologies during the phase separation process, which is discussed in the second part of this series. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3953–3963, 2004

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Investigation of thermoplastic-modified thermosets: positron annihilation and related studies of an amine-cured epoxy resin

Cited by 30 publications

References 18 publications

Dielectric and mechanical properties of diglycidyl ether of bisphenol a modified by a new fluoro-terminated hyperbranched poly(phenylene oxide)

Dielectric and mechanical properties of diglycidyl ether of bisphenol a modified by a new fluoro-terminated hyperbranched poly(phenylene oxide)

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

Reaction‐induced phase separation in epoxy/polysulfone/poly(ether imide) systems. I. Phase diagrams

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