Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package

Che, Fa Xing; Ong, Yeow Chon; Pan, Ling; Chen, Wren; Yu, Wei; Ng, Hong Wan

doi:10.1109/eptc59621.2023.10457926

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023

DOI: 10.1109/eptc59621.2023.10457926

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Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package

Fa Xing Che,

Yeow Chon Ong,

Ling Pan

et al.

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Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package

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References 11 publications

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