(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Cioccio, L. Di; Gueguen, Pierric; Taibi, R.; Landru, Didier; Gaudin, G.; Chappaz, C.; Rieutord, F.; Crecy, F. de; Radu, Ionut; Chapelon, L.L.; Clavelier, L.

doi:10.1149/1.3483489

Cited by 12 publications

(1 citation statement)

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“…More importantly, if the Cu/Cu interface is defective, e.g., pre-existing interfacial voids or nanoscale roughness due to weak sample preparation and annealing process, damage mechanisms, such as void growth, void coalescence, and mechanical failure, might occur. 26,29,30 This would deteriorate the mechanical integrity and electronic reliability of the components. 31,32 Hence, a deep understanding of the mechanical response of interfacial voids to the annealing-induced tensions is crucial for the successful fabrication of the components.…”

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confidence: 99%

Effect of Annealing-Induced Tensions on the Mechanical Failure of Copper/Copper Interface in Wafer-to-Wafer Hybrid Bonding

Ghaemi

Jafary-Zadeh

2021

ECS J. Solid State Sci. Technol.

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The copper/copper (Cu/Cu) interface has an important role in wafer-to-wafer hybrid bonding for 3D integration applications. Reports indicate the possibility of the formation of post-bonding interfacial voids and cracks which must be avoided. Here, we use molecular dynamics simulations to investigate the effect of annealing-induced tensions on the strength and deformation mechanisms of Cu/Cu interfaces. We perform tensile tests on the pristine and defective Cu/Cu interfaces including a prototypical interfacial grain boundary in two defective limits: the presence of a single (isolated) void, and an array of multiple voids. The latter resembles interfacial nanoscale roughness as a result of weak sample preparation and bonding conditions. We show that in the limit of isolated voids, the strength of the system is lower than that of the pristine interface. The corresponding deformation mechanism is ductile and through dislocation activities which could be accompanied by void growth. In contrast, multiple interfacial voids lead to a ductile-to-brittle transition in the failure mechanism accompanied by a drastic reduction of the system strength. Our findings shed light on the importance of process control to assure the integrity and reliability of the bonded components.

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confidence: 99%