Abstract:In this paper we present a multifunctional technology platform with different monolithic integrated modules like THz devices, i.e. complementary SiGe heterojunction bipolar transistors, silicon photonics components in particular Ge-PIN photo detectors and finally the wafer-level integration of µ-fluidic channels for sensor applications. Challenges during the monolithic integration of these different modules were reviewed and necessary process adaptations discussed in order to enable a co-integration.
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