Abstract:IntrOductIOnBonding is the most sensitive procedure during orthodontic treatment. The presence of moisture in the oral cavity is the most common cause for bond failure. Contamination causes plugging of the porosities which are produced by acid etching and this reduces the surface energy. As the resin penetration is impaired it leads to poor mechanical interlocking [1]. The detrimental effect of moisture on orthodontic bonding could be due to induction of the plasticizing effect in the polymer network caused by… Show more
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