Ion-beam mixing with chemical guidance IV. Thermodynamic effects without invoking thermal spikes

Stress-related interdiffusion in dc sputtered TiN/B–C–N multilayers

“…This effect is relatively small in this case ͑but not negligible͒ and this is probably due to the fact that at 1000°C, the compressive stress field is elimi-nated in much less than an hour 16 and is therefore biasing the atomic diffusion for only a short time. The very small intermixing (I 2 /I 1 ϭ0.9) observed after irradiation of the stress free multilayer agrees well with the classical description of ion mixing that includes ballistic and chemically guided intermixing [17][18][19][20] in the case of nonmiscible components. In order to analyze the role of the stress field during ion irradiation, Eq.…”

Ion-beam mixing in energetic collision cascades: Thermal-spike model and experiments

“…The nature of atomic mixing during energetic displacement cascades has been of interest to scientists for over four decades. [1][2][3][4][5][6][7][8][9][10][11] For high deposited-energydensity cascades with heavy ions and matrices (Z . 20), various experiments of ion-beam mixing by lowtemperature implantations have suggested correlations between the mixing rate Dt, and a thermodynamic characteristic, the heat of mixing DH mix .…”

Enhanced diffusion of Cu in aluminium under low-energy ion bombardment

“…The Cu-Al couple appears particularly suited for the investigation of the effects of large vacancy concentrations, since Peterson et al [4] showed that the binding energy of copper to vacancies in aluminium is small and the activation energy for diffusion close to that of selfdiffusion. This is supported also by the investigation of the effect of the heat of mixing ∆H m on diffusion in bi-layers under bombardment of ions [5], since the results indicated particularly large intermixing efficiencies with the Cu-Al couple [6]. Moreover, Barnes et al [7] observed diffusion of thermal Cu atoms into (100) Al cooled down to 120 K, although the process should be severely kinetically limited.…”

“…The effect of chemical driving force on mixing during deposition of Cu on aluminium, at 120 K [7] and at higher temperature [13], was subsequently considered by Sprague et al [14]. It may be quantitatively assessed [5] by including the Darken factor, (1 − 2∆E ch /kT ) into the expression for the evaluation of the coefficient of diffusion [15]. At the actual chemical driving energy, ∆E ch = 2.53 eV [6], the Darken factor enhanced the diffusion by a factor of ∼ 175.…”