IET International Conference on Communication Technology and Application (ICCTA 2011) 2011
DOI: 10.1049/cp.2011.0743
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IoT business models and extended technical requirements

Xueqin Jia
1
,
Wang Jing
2
,
Qing He
3
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Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies

Mackowiak
1
,
Samer
2
,
Lang
3
et al. 2019
2019 12th International Conference on Developments in eSystems Engineering (DeSE)
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Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies

Mackowiak
1
,
Samer
2
,
Lang
3
et al. 2019
2019 12th International Conference on Developments in eSystems Engineering (DeSE)
0
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0
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High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications

Zoschke
1
,
Mackowiak
2
,
Ngo
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications

Zoschke
1
,
Mackowiak
2
,
Ngo
3
et al. 2019
2019 International Wafer Level Packaging Conference (IWLPC)
3
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