2023
DOI: 10.1109/tcpmt.2023.3288612
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Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review

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Cited by 10 publications
(2 citation statements)
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“…1 Advanced heat dissipation systems deployed include microheat pipes, 2 heat pumps, 3 thermoelectric cooling, 4 boiling heat transfer, 5 and jet impingment. 6 Among these, the liquid-cooled microchannel heat sink (MCHS) is proven effective in cooling microelectronic devices. [7][8][9] While increasing heat flux in the circuit remains an outstanding problem associated with the design of MCHS, it presents other challenges, like nonuniform cooling and the formation of thermal hotspots, which must be resolved as well.…”
Section: Introductionmentioning
confidence: 99%
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“…1 Advanced heat dissipation systems deployed include microheat pipes, 2 heat pumps, 3 thermoelectric cooling, 4 boiling heat transfer, 5 and jet impingment. 6 Among these, the liquid-cooled microchannel heat sink (MCHS) is proven effective in cooling microelectronic devices. [7][8][9] While increasing heat flux in the circuit remains an outstanding problem associated with the design of MCHS, it presents other challenges, like nonuniform cooling and the formation of thermal hotspots, which must be resolved as well.…”
Section: Introductionmentioning
confidence: 99%
“…Conventional heat sink systems, consisting of fins and air‐cooling systems, are found to be inadequate, not only due to constraints of physical space but also because of lower thermal properties 1 . Advanced heat dissipation systems deployed include microheat pipes, 2 heat pumps, 3 thermoelectric cooling, 4 boiling heat transfer, 5 and jet impingment 6 …”
Section: Introductionmentioning
confidence: 99%