2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.250
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Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste

Kyoung-Ho Kim
1
,
Sehoon Yoo
2
,
Jeong Whan Yoon3
et al.
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