Kinetic study on low temperature coalescence of carboxylate-protected Ag nanoparticles for interconnect applications

Abstract

Coalescence of carboxylate-capped Ag nanoparticles can be achieved by soaking the deposits in ascorbic acid solution. Long-chain carboxylates are easier to remove. Conductive and bendable films can form on PDMS substrate using this method.

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

“…The major PVP peaks were 1650 cm −1 , 1428 cm −1 , and 1288 cm −1 . As also indicated in Figure 6 a, ν as CH 2 , ν s CH 2 , ν as CO 2 − , and ν s CO 2 − stretching peaks were detected [ 22 ]. After being subjected to thermal compression at 160 °C for 30 min, there was almost nothing left of the sintered LNCP (red curve), as shown in Figure 6 b.…”

Low-Thermal-Budget Photonic Sintering of Hybrid Pastes Containing Submicron/Nano CuO/Cu2O Particles

“…An important trend in microelectronics is the manufacture of conductive circuits, interconnections, and joints at low processing temperatures by metallic NPs and their low sintering temperature. The surfactants of NPs need be desorbed, and the NPs coalesce to achieve conductive networks with favorable mechanical strength and electrical conductance [ 1 , 2 , 3 , 4 , 5 ].…”

All-Carboxylate-Protected Superatomic Silver Nanocluster with an Unprecedented Rhombohedral Ag8 Core

“…In contrast, it is much more challenging to obtain atomically precise CMNCs with the hard-base ligands containing N and O donors, even though those ligands are often used in preparing larger coinage-metal nanoparticles . Some recent successes in synthesizing hard-base-ligand-protected CMNCs suggested promising routes to overcome the challenge.…”