Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Zhu, Liang; Mei, Biao; Zhu, Weidong; Li, Wenyuan

doi:10.3390/s20061603

Cited by 2 publications

(2 citation statements)

References 21 publications

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“…For proper performance of the integrated circuits, the silicon wafers are required to have specific thickness. Thus, monitoring of wafer thickness based on the scan data of a laser probe is usually used (Zhu et al 2020).…”

Section: Validation Through An Implementation Showcasementioning

confidence: 99%

A smart process controller framework for Industry 4.0 settings

Cohen

Singer

2021

J Intell Manuf

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This paper presents a smart supervisory framework for a single process controller, designed for Industry 4.0 shop floors. This digitization of a full supervisory suite for a single process controller enables self-awareness, self-diagnosis, self-prognosis, and self-healing (by definition, these "self" elements are missing from other supervisory frameworks diagnosing numerous controllers in parallel). The proposed framework is aligned with the concept of a Cyber Physical System (CPS), since its implementation generates a rich cyber physical entity of the controlled process. This CPS entity can either be considered as the process digital twin, or can provide a solid basis for generating it. Finally, the framework includes the main characteristics of Industry 4.0, such as advanced use of Artificial Intelligence (AI) and big data analysis. The framework is based on four modules: (1) Control and Awareness module-performing both continuous process control and adjustments, as well as machine learning (ML) and statistical process control (SPC) for identifying abnormalities that require further diagnosis; (2) Process-diagnosis module-performing continual (recurrent) analysis of the process state and trends; (3) Prognosis and Healing module-performing prognosis and automated intervention via parameter changes, re-configurations, and automated maintenance; (4) External Interaction Platform-an interactive module for interfacing with experts, presenting them with the process analysis information and obtaining feedback from them as part of a learning process. Using an implementation showcase to illustrate the methodological framework's applicability, we demonstrate its real-world potential. The proposed framework could serve as a guide for implementing smart process control and maintenance systems in Industry 4.0 shop floors. It could also provide a firm basis for comparison with future suggested frameworks. Future research directions could include pursuing improvements to the proposed process control framework and validating the framework by case studies of its implementation.

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Section: Validation Through An Implementation Showcasementioning

confidence: 99%

A smart process controller framework for Industry 4.0 settings

Cohen

Singer

2021

J Intell Manuf

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“…There have been numerous studies aimed at reducing solar energy prices further by various processes, such as research on improving and optimizing the solar cells production technology [3][4][5][6][7][8][9], controlling Si wafer thickness [10], and combining the different renewable energy systems in to a multigeneration system [11,12]. Research and development to obtain and purify Si, used as the raw material for the production of solar cells based on crystalline Si are also needed and therefore conducted in different ways.…”

Section: Introductionmentioning

confidence: 99%

The Possibility of Silicon Purification by Metallurgical Methods: Part I

et al. 2022

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This silicon purification research work has two stages and results will be provided in two articles due to the large scope of work. This paper provides the results of the first stage, concerning the metallurgical silicon purification. Silicon was purified by a combined method consisting of slag refining with new slag composition and acid leaching. In the first phase, the metallurgical grade silicon produced by the classical carbothermic reduction method was investigated. In the second phase, the metallurgical purification by slag refining was completed using slags of various new compositions. The purified silicon samples obtained after the melting processes were analyzed for concentrations of impurities. Finally, acid leaching treatment of the obtained silicon was done, followed by elemental analysis of purified silicon. According to our experience we can determine that obtained silicon purity is adequate for further stages of planned study.

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Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers

Cited by 2 publications

References 21 publications

A smart process controller framework for Industry 4.0 settings

A smart process controller framework for Industry 4.0 settings

The Possibility of Silicon Purification by Metallurgical Methods: Part I

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