1973
DOI: 10.1109/proc.1973.9071
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Limitations on high-temperature processing of aluminum-copper metallization

Abstract: type in Fig. 2(c), all such systems being fed in parallel. (This is a special case of (S).) Similarly for (lo), except that now the coefficients ci, replace the y;, in Fig. 2(c) and generate sensitivity system poles which cancel one pair of zeros in Y. Hence this method is not suitable in general for non-minimum-phase zeros, though one pair of such zeros may be accommodated in the last stage of the cascade, the sensitivities being obtained without the need for an additional model, as in Fig. 2(a).In view of th… Show more

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“…In addition, the adherence, etching, step coverage, bonding, and contact resistance properties for the above alloys remain essentially the same as for aluminum while resistivity is increased only about 15%. Care must be exercised in postmetallization heat-treatments because of the reduced eutectic temperatures of the alloys (255). With one possible exception, it may therefore be stated that the employment of aluminum alloy metallization has allowed the requirements for metallization on silicon to be met and has greatly extended the usefulness of a basically aluminum process.…”
Section: Discussionmentioning
confidence: 99%
“…In addition, the adherence, etching, step coverage, bonding, and contact resistance properties for the above alloys remain essentially the same as for aluminum while resistivity is increased only about 15%. Care must be exercised in postmetallization heat-treatments because of the reduced eutectic temperatures of the alloys (255). With one possible exception, it may therefore be stated that the employment of aluminum alloy metallization has allowed the requirements for metallization on silicon to be met and has greatly extended the usefulness of a basically aluminum process.…”
Section: Discussionmentioning
confidence: 99%